Microelectronics Engineering Group

Microelectronics Engineering Group

Electronics Technology, Systems and Automation Engineering Department University of Cantabria
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Title:Experimental Analysis of Transient Current Test Based on dIDD Variations in S2I Memory Cells
Type:International Conference
Where:XIX Conference on Design of Circuits and Integrated Systems (DCIS2004). Bordeaux (France)
Date:2004-11
Authors: Yolanda Lechuga
Román Mozuelos
Miguel Angel Allende
Mar Martínez
Salvador Bracho
R&D Lines: Test methods of digital and mixed integrated circuits
Projects: Técnicas de Test para Circuitos Mixtos, Analógicos-Digitales. Aplicación ...
ISBN:2-9522971-0-X
PDF File:
Abstract:The current variations, δIDD, appearing in the memory cells of SI circuits in the presence of faults, give rise to changes in the overall dynamic supply current, IDDT, which are analyzed in the test methods based on this IDDT current.
The capability of propagation of the effects of the faults injected inside the circuit can be considered, and we will call it as fault reflection.
Basing on this fault reflection mechanism, a new test method that directly analyzes the current variations, δIDD, appearing in one of the memory cells that constitute the SI circuit, has been developed.
This test method has the advantage of avoiding the losses of information appearing in the integration of the IDDX signal, which can mask the effects of the faults.
We have designed and built, in AMS 0.6 technology, a benchmark circuit based on a switched-current algorithmic A/D Converter topology to establish the fault coverage obtained with this new test method, by real measurements; and conclusions have been extracted.
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